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May 06, 2024
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ECE 684 - Power Electronics Packaging3 Credit Hours Power electronics packaging materials and procedures for silicon, silicon carbide, and gallium nitride devices. Packaging techniques (printed circuit board assembly and wire bonding), thermal management in power modules, and packaging related EMI. Electro-thermal and circuit simulation to model the impact of parasitics in power electronic modules. Registration Restriction(s): Minimum student level – graduate.
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